The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Jun. 30, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Srikanth Krishnamurthy, Bangalore, IN;

Ming Xu, San Jose, CA (US);

Ashley M. Okada, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/56 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); C23C 16/455 (2006.01); G01F 1/688 (2006.01); H01L 21/768 (2006.01); H05H 1/24 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
G01F 1/56 (2013.01); B81B 7/0058 (2013.01); B81B 7/0061 (2013.01); B81C 1/00301 (2013.01); B81C 1/00309 (2013.01); C23C 16/45504 (2013.01); C23C 16/45544 (2013.01); C23C 16/45557 (2013.01); C23C 16/45561 (2013.01); G01F 1/688 (2013.01); H01L 21/76811 (2013.01); H05H 1/2418 (2021.05); B81B 2201/0292 (2013.01); B81B 2203/04 (2013.01); B81B 2207/093 (2013.01); B81C 2203/019 (2013.01); B81C 2203/035 (2013.01); B81C 2203/036 (2013.01); B81C 2203/054 (2013.01); H01J 37/3244 (2013.01); H01J 2237/24585 (2013.01);
Abstract

Certain embodiments of the present disclosure relate to a sensor assembly including a housing having a first channel configured to flow a gas in a first direction and a second channel configured to flow the gas in a second direction. The housing is configured to couple to a gas flow assembly. A substrate is disposed within the housing. The substrate has an outer region, an inner region within the first channel, and a middle region between the outer region and the inner region. The substrate further includes electrical contact pads on at least the inner region. A sensor die is coupled to the inner region of the substrate, having an electrical connection to the electrical contact pads. The sensor die is disposed within a gas flow path of the first channel.


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