The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Jun. 30, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventor:

Vijay Parkhe, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 3/20 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); C23C 16/455 (2006.01); G01F 1/56 (2006.01); G01F 1/688 (2006.01); G01N 3/08 (2006.01); G01N 3/14 (2006.01); H01L 21/768 (2006.01); H05H 1/24 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
G01F 1/56 (2013.01); B81B 7/0058 (2013.01); B81B 7/0061 (2013.01); B81C 1/00301 (2013.01); B81C 1/00309 (2013.01); C23C 16/45504 (2013.01); C23C 16/45544 (2013.01); C23C 16/45557 (2013.01); C23C 16/45561 (2013.01); G01F 1/688 (2013.01); H01L 21/76811 (2013.01); H05H 1/2418 (2021.05); B81B 2201/0292 (2013.01); B81B 2203/04 (2013.01); B81B 2207/093 (2013.01); B81C 2203/019 (2013.01); B81C 2203/035 (2013.01); B81C 2203/036 (2013.01); B81C 2203/054 (2013.01); H01J 37/3244 (2013.01); H01J 2237/24585 (2013.01);
Abstract

A sensor assembly includes a substrate having an outer region, an inner region, and a middle region between the outer region and the inner region. The substrate further includes electrical contact pads on at least the inner region. The sensor assembly further includes a housing coupled to the substrate at the middle region or the outer region to provide a hermetic seal. The sensor assembly further includes a sensor die bonded to the substrate at the inner region. A metal bond bonds electrodes of the sensor die to the electrical contact pads. The metal bond includes platinum, and/or one or more metals selected from tin, indium, copper, aluminum, and/or nickel.


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