The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Jan. 11, 2022
Applicant:

Oscps Motion Sensing Inc., Montreal, CA;

Inventors:

Kazem Zandi, Montreal, CA;

Richard Beaudry, Granby, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01C 19/66 (2006.01); G02B 6/12 (2006.01); G02B 6/124 (2006.01); G02B 6/132 (2006.01); G02B 6/136 (2006.01);
U.S. Cl.
CPC ...
G01C 19/661 (2013.01); G02B 6/12007 (2013.01); G02B 6/124 (2013.01); G02B 6/132 (2013.01); G02B 6/136 (2013.01); G02B 2006/12104 (2013.01); G02B 2006/12107 (2013.01); G02B 2006/12121 (2013.01);
Abstract

An optical ring resonator-based gyroscope includes a photonic integrated circuit (PIC) chip including a plurality of optical elements, the plurality of optical elements including a resonator ring; and a printed circuit board including a plurality of electrical components, the photonic integrated circuit being mounted on a surface of the printed circuit board, the photonic integrated circuit and the printed circuit board being electrically connected. A photonic integrated circuit (PIC) chip including a substrate; a dielectric layer; a first waveguide layer forming at least: a ring resonator and reflector portions; a second waveguide layer forming at least: vertical Bragg grating couplers disposed over one of the plurality of reflector portions, a chip waveguide; a magneto-optic layer encapsulated in the dielectric layer; and a metal layer forming a plurality of metal connection pads and a plurality of wire traces for electrically connecting the PIC chip to electronic components.


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