The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Apr. 19, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Thomas Werner Zilbauer, Gauting, DE;

Andreas Lopp, Freigericht, DE;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/35 (2006.01); C23C 14/00 (2006.01); C23C 14/08 (2006.01); C23C 14/14 (2006.01); C23C 14/34 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
C23C 14/351 (2013.01); C23C 14/0068 (2013.01); C23C 14/3407 (2013.01); H01J 37/32651 (2013.01); H01J 37/32669 (2013.01); H01J 37/3405 (2013.01); H01J 37/3452 (2013.01); C23C 14/086 (2013.01); C23C 14/14 (2013.01); H01J 2237/081 (2013.01); H01J 2237/332 (2013.01);
Abstract

A sputter deposition source for depositing a material on a substrate is described. The sputter deposition source includes an array of magnetron sputter cathodes arranged in a row for coating the substrate in a deposition area on a front side of the array. At least one magnetron sputter cathode of the array includes a first rotary target rotatable around a first rotation axis (A); and a first magnet assembly arranged in the first rotary target and configured to provide a closed plasma racetrack (P) on a surface of the first rotary target that extends along the first rotation axis (A) on a first side and on a second side of the at least one magnetron sputter cathode. Further described is a magnetron sputter cathode for a sputter deposition source and a method of depositing a material on a substrate.


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