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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12552972 B1

PDFFull Text
Date of Patent:
Feb. 17, 2026

Filed:

Jul. 14, 2021

Conductive adhesive composition

Applicant:

Kyoto Elex Co., Ltd., Kyoto, JP;

Inventors:

Takamitsu Arai, Kyoto, JP;

Takayuki Kasugai, Kyoto, JP;

Nobuo Ochiai, Kyoto, JP;

Satoru Tomekawa, Kyoto, JP;

Assignee:

KYOTO ELEX CO., LTD., Kyoto, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

William D Young

Int. Cl.
CPC ...
C09J 9/02 (2006.01); C08G 18/10 (2006.01); C08G 18/67 (2006.01); C08G 18/73 (2006.01); C08K 3/08 (2006.01); C09J 11/04 (2006.01); C09J 175/14 (2006.01); H01B 1/22 (2006.01); H10F 77/20 (2025.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C08G 18/10 (2013.01); C08G 18/672 (2013.01); C08G 18/73 (2013.01); C09J 11/04 (2013.01); C09J 175/14 (2013.01); H01B 1/22 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/001 (2013.01); C08K 2201/003 (2013.01); H10F 77/211 (2025.01);
Abstract

The present invention relates to an electrically conductive adhesive composition including: a conductive powder (A) and a curable component (B) which has a content of 20 5 parts by mass or more when an amount of the conductive powder (A) is 100 parts by mass; and a phosphoric acid-containing curable component (C) having a general formula of formula (1) or (2), and having a molecular weight within a range of 150 to 1000, in which the phosphoric acid-containing curable component (C) has a content of 0.01 parts by mass or more and 5 parts by mass or less when a total amount of the conductive powder (A) and the 10 curable component (B) is 100 parts by mass.

Find Patent Forward Citations

Arai, Takamitsu. (2026). Conductive adhesive composition (U.S. Patent No. 12552972). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12552972

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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