The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Aug. 26, 2022
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventors:
Paolo Ferrari, Gallarate, IT;
Lorenzo Corso, Ruginello, IT;
Flavio Francesco Villa, Milan, IT;
Silvia Nicoli, Casatenovo, IT;
Luca Lamagna, Cassina de' Pecchi, IT;
Assignee:
STMICROELECTRONICS S.r.l., Agrate Brianza, IT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/02 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00341 (2013.01); B81B 7/02 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81C 2201/0109 (2013.01); B81C 2201/0133 (2013.01); B81C 2201/014 (2013.01); B81C 2201/0176 (2013.01); B81C 2203/032 (2013.01); B81C 2203/035 (2013.01);
Abstract
Method for manufacturing a micro-electro-mechanical system, MEMS, integrating a first MEMS device and a second MEMS device. The first MEMS device is a capacitive pressure sensor and the second MEMS device is an inertial sensor. The steps of manufacturing the first and second MEMS devices are, at least partly, shared with each other, resulting in a high degree of integration on a single die, and allowing to implement a manufacturing process with high yield and controlled costs.