Ovenable flexible packaging structure

Abstract

The present disclosure relates generally to flexible product packaging and, in particular, to flexible packaging structures for products such as food products stored and transported for later reheating or cooking. In one aspect, an ovenable flexible packaging structure includes a paper layer having a first major surface and a second major surface opposite the first major surface, the paper layer having a cutout defining a window. A printed ink layer is disposed on the first major surface of the paper layer and a varnish layer is disposed over the printed ink layer. A heat sealable polyester layer is disposed on the second major surface of the paper layer, the heat sealable polyester layer having a strip of perforations formed therein. The strip of perforations and the cutout are at least partially overlapping with each other. An adhesive layer intermediate the paper layer and the heat sealable polymer layer includes an adhesive for adhesively bonding the paper layer to the heat sealable polymer layer. In further aspects, packaging articles formed of the flexible packaging structures and methods for making the flexible packaging structures and packaging articles are provided.