The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
May. 25, 2023
Tdk Corporation, Tokyo, JP;
Yohei Sato, Tokyo, JP;
Osamu Shindo, Tokyo, JP;
Hiroshi Koizumi, Tokyo, JP;
Makoto Yamashita, Tokyo, JP;
Yasuo Kato, Tokyo, JP;
Mitsuyoshi Makida, Tokyo, JP;
Masashi Matsumoto, Tokyo, JP;
TDK CORPORATION, Tokyo, JP;
Abstract
Provided is a substrate processing apparatus capable applying a uniform load to an object to be pressurized. The substrate processing apparatus includes a lower jig platefor arranging a substratewhich is an object to be pressurized, an upper jig plateapplying pressure to the substratearranged to the lower jig plate, and a support membersupporting the lower jig plateand providing a support force to the lower jig platein accordance with a in-plane distribution of a load applied to the lower jig plate