The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Dec. 02, 2022
Applicant:

Asahi Yukizai Corporation, Nobeoka, JP;

Inventors:

Hiroshi Suenaga, Nobeoka, JP;

Hiroyuki Matsushita, Nobeoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/02 (2006.01); B29C 43/00 (2006.01); B29C 69/00 (2006.01); B29K 27/18 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/02 (2013.01); B29C 43/003 (2013.01); B29C 69/00 (2013.01); B29K 2027/18 (2013.01); B29L 2031/7506 (2013.01); B29L 2031/755 (2013.01);
Abstract

This method for producing a resin bonded body includes: forming a first resin assembly of a shape having an accommodation portion from a first fluororesin material that is capable of gelling and maintaining shape even at or above the melting point thereof; a step for accommodating a second resin assembly composed of a second fluororesin material that melts and becomes liquid at or above the melting point thereof within the accommodation portion. The method includes heating the first resin assembly having the second resin assembly disposed in the accommodation portion to or above the melting point of the first fluororesin material and the second fluororesin material before cooling the first resin assembly, changing the first resin assembly into a first resin molded body and the second resin assembly into a second resin molded body, and bonding the first and second resin molded bodies.


Find Patent Forward Citations

Suenaga, Hiroshi. (2026). Resin joined body manufacturing method (U.S. Patent No. 12552108). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12552108

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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