The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Jan. 19, 2022
Kyoraku Co., Ltd., Kyoto, JP;
Tadatoshi Tanji, Yamato, JP;
KYORAKU CO., LTD., Kyoto, JP;
Abstract
A resin residue removal device is provided that is capable of appropriately removing a resin residue adhered to a lower surface of a die of a molding apparatus. The present invention provides a resin residue removal device for removing a resin residue adhered to a lower surface of a die of a molding apparatus, the device including a moving mechanism and a resin residue removal head, wherein the moving mechanism is configured to move the resin residue removal head between a lateral position out of a position immediately below the die and an immediately below position as the position immediately below, and also in the immediately below position, to move the head between a separate position separate from the lower surface and a close position close to the lower surface, and the resin residue removal head is configured to allow removal of the resin residue adhered to the lower surface by moving along the lower surface.