The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Oct. 29, 2018
Applicant:

Metso Finland Oy, Espoo, FI;

Inventor:

Kaj Jansson, Tampere, FI;

Assignee:

Metso Finland Oy, Espoo, FI;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B03D 1/02 (2006.01); B03D 1/14 (2006.01); C02F 9/00 (2023.01); C02F 1/00 (2023.01); C02F 1/24 (2023.01); C02F 1/52 (2023.01); C02F 101/10 (2006.01); C02F 103/10 (2006.01);
U.S. Cl.
CPC ...
B03D 1/028 (2013.01); B03D 1/1431 (2013.01); C02F 9/00 (2013.01); B03D 2203/008 (2013.01); B03D 2203/04 (2013.01); C02F 1/001 (2013.01); C02F 2001/007 (2013.01); C02F 1/24 (2013.01); C02F 1/5245 (2013.01); C02F 1/5263 (2013.01); C02F 2101/10 (2013.01); C02F 2103/10 (2013.01); C02F 2303/04 (2013.01);
Abstract

A method for treating process water of a flotation arrangement is disclosed. The process comprising the steps of a) dewatering overflow of a mineral flotation circuit in a gravitational solid-liquid separator to separate a sediment from a supernatant comprising water, silica-containing particles and soluble SiO2, fine particles, microbes, and residual flotation chemicals; b) subjecting the supernatant to cleaning flotation, in which at least 90% of the flotation gas bubbles have a size from 0.2 to 250 μm, in a cleaning flotation unit for collecting at least silica-containing particles, for separating at least silica-containing particles from the supernatant into cleaning flotation overflow, and for forming purified process water as cleaning flotation underflow; c) removing cleaning flotation overflow as tailings; and d) recirculating purified process water into the mineral flotation circuit. A process water treatment arrangement is also disclosed.


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