The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Aug. 20, 2024
Applicant:
Darwin Precisions Corporation, Hsinchu County, TW;
Inventors:
Wen-Chuan Chen, Hsinchu County, TW;
Cheng-Hsiung Chen, Hsinchu County, TW;
Assignee:
DARWIN PRECISIONS CORPORATION, Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61M 37/00 (2006.01);
U.S. Cl.
CPC ...
A61M 37/0015 (2013.01); A61M 2037/0023 (2013.01); A61M 2037/0046 (2013.01);
Abstract
A microneedle device includes a substrate and a plurality of microneedle structures. The substrate is provided with a first surface, where the first surface has a surface roughness ranged from 0.05 μm to 2.0 μm. The plurality of microneedle structures are configured on the first surface. Because the surface of the microneedle device has a surface roughness of 0.05 μm to 2.0 μm, a film can be formed completely.
Chen, Wen-Chuan. (2026). Microneedle device (U.S. Patent No. 12551676). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12551676
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile