The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Mar. 15, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Hun Seong Choi, Suwon-si, KR;
Wooseok Chang, Suwon-si, KR;
Junyeon Lee, Suwon-si, KR;
Minkyu Kim, Suwon-si, KR;
Byungwoo Bang, Suwon-si, KR;
Jiye Choi, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A stacked IC package includes a first die including a first power transmission region, an adapter die stacked on the first die, a second die stacked on the adapter die and including a second power transmission region, and a first power transmission path electrically connected between the second power transmission region and the first power transmission region through the adapter die. The first power transmission path includes a first power transmission part penetrating a portion of the adapter die in a vertical direction from the first power transmission region, a second power transmission part including a connected part in a horizontal direction from the first power transmission part in the adapter die, and a third power transmission part connected to the second power transmission region in the vertical direction from the second power transmission part. A voltage conversion circuit is arranged on the first power transmission path.