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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12550788 B1

PDFFull Text
Date of Patent:
Feb. 10, 2026

Filed:

Jan. 17, 2023

Low z-height led array package having tsv support structure

Applicant:

Lumileds Singapore Pte. Ltd., Singapore, SG;

Inventors:

Tze Yang Hin, Cupertino, CA (US);

Erik Young, San Jose, CA (US);

Kentaro Shimizu, Sunnyvale, CA (US);

Grigoriy Basin, San Francisco, CA (US);

Emma Dohner, Menlo Park, CA (US);

Brendan Jude Moran, San Jose, CA (US);

Assignee:

Lumileds Singapore Pte. Ltd., Singapore, SG;

Attorney:

Schwegman, Lundberg & Woessner, P.A.

Primary Examiner:

Mary Ellen Bowman

Int. Cl.
CPC ...
H01L 25/18 (2023.01); F21S 41/141 (2018.01); F21S 41/20 (2018.01); G03B 15/05 (2021.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/075 (2006.01); H10H 20/825 (2025.01); H10H 20/851 (2025.01); H10H 20/855 (2025.01); H10H 20/857 (2025.01); H10H 29/14 (2025.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/5384 (2013.01); H01L 24/08 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 25/0753 (2013.01); H10H 20/825 (2025.01); H10H 20/8512 (2025.01); H10H 20/855 (2025.01); H10H 20/857 (2025.01); H10H 29/142 (2025.01); F21S 41/141 (2018.01); F21S 41/285 (2018.01); G03B 15/05 (2013.01); G03B 2215/0567 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/014 (2013.01);
Abstract

A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.

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