The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Aug. 19, 2022
Applicant:

Schott Ag, Mainz, DE;

Inventors:

Jens Ulrich Thomas, Mainz, DE;

Thorsten Damm, Eltville am Rhein, DE;

Thomas Zetterer, Landshut, DE;

Assignee:

Schott AG, Mainz, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); B23K 26/20 (2014.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 23/291 (2013.01); B23K 26/206 (2013.01); H01L 23/15 (2013.01); Y10T 428/131 (2015.01);
Abstract

A package for encapsulating a functional area against an environment includes a base substrate and a cover substrate, the base substrate together with the cover substrate defining at least part of the package or defining the package, and furthermore including the at least one functional area provided in the package, and a blocking way for reducing permeation between the environment and the functional area. The package may include at least one laser bonding line, and the substrates of the package can be hermetically joined to one another by the at least one laser bonding line, and the laser bonding line has a height (HL) perpendicular to its bonding plane.


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