The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Oct. 21, 2020
Mitsubishi Electric Corporation, Tokyo, JP;
Tetsujiro Tsunoda, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An object is to provide a technique capable of enhancing the heat dissipation characteristics of a semiconductor device. The semiconductor device includes a heat dissipation plate, a layer member connected to the heat dissipation plate, a first semiconductor element, and a second semiconductor element. The first semiconductor element and the second semiconductor element are connected to the layer member on a side opposite to the heat dissipation plate, and separated from each other by a gap. The heat dissipation plate includes a thick portion and a thin portion thinner than the thick portion. The thin portion is in contact with a groove portion provided on a surface of the heat dissipation plate opposite to the layer member, and overlaps the gap in plan view.