The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Sep. 28, 2021
Applicant:
Lipac Co., Ltd., Seoul, KR;
Inventors:
Assignee:
LIPAC CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/04 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2023.01); H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 23/04 (2013.01); H01L 23/293 (2013.01); H01L 23/31 (2013.01); H01L 23/49816 (2013.01); H01L 23/5386 (2013.01); H01L 25/167 (2013.01); H10F 39/806 (2025.01);
Abstract
There is provided a semiconductor package. The semiconductor package includes: a semiconductor chip; a mold configured to encapsulate the chip; a redistribution layer; and an optical device electrically connected to the chip through the redistribution layer. The mold is formed with an optical path passing through the mold, and light is input to or output from the optical device through the optical path.