The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Sep. 14, 2022
International Business Machines Corporation, Armonk, NY (US);
Vinay Pai, Voorheesville, NY (US);
Nikhil Jain, Apple Valley, MN (US);
Alex Richard Hubbard, Rensselaer, NY (US);
Cody J. Murray, Burnt Hills, NY (US);
Richard C. Johnson, Selkirk, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Described is a semiconductor processing system including a measurement tool configured to measure warpage characteristics in a semiconductor wafer. The semiconductor processing system further includes a pixelated surface configured to retain the semiconductor wafer, where the pixelated surface approximates the warpage characteristics to conform to the semiconductor wafer. The semiconductor processing system further includes a semiconductor processing tool configured to perform processing on the semiconductor wafer while it is retained on the pixelated surface.