The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Nov. 10, 2022
Applicant:

Nec Corporation, Tokyo, JP;

Inventors:

Ayami Yamaguchi, Tokyo, JP;

Kenji Nanba, Tokyo, JP;

Assignee:

NEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 60/81 (2023.01); H10N 60/01 (2023.01);
U.S. Cl.
CPC ...
H10N 60/81 (2023.02); H10N 60/01 (2023.02);
Abstract

To provide a superconducting device capable of more accurately arranging a non-contact coupling circuit of a superconducting integrated circuit chip and a non-contact coupling circuit of a circuit board. The chip has a first electrode made of a first superconducting material and a first non-contact coupling circuit on a surface thereof. The board has a second electrode made of a second superconducting material and a second non-contact coupling circuit on a surface thereof, and is arranged to face the chip. The second electrode has a protrusion protruding toward the chip. The protrusion includes a flat upper surface. The first electrode has a flat surface and a first recess. The first recess is arranged to face the upper surface to be located inside the upper surface of the protrusion. A third superconducting material connecting the upper surface and the first recess.


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