The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Nov. 14, 2022
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Dong Sung Lee, Suwon-si, KR;

Yong Hoon Kwon, Suwon-si, KR;

Mi Sun Kim, Hwaseong-si, KR;

Byung Hoon Kim, Hwaseong-si, KR;

Tae Oh Kim, Suwon-si, KR;

Se Hun Choi, Asan-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/831 (2025.01); G09F 9/302 (2006.01); G09F 9/33 (2006.01); H10H 20/01 (2025.01); H10H 20/851 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10H 20/8312 (2025.01); G09F 9/3026 (2013.01); G09F 9/33 (2013.01); H10H 20/01 (2025.01); H10H 20/8514 (2025.01); H10H 20/857 (2025.01); H10H 20/032 (2025.01); H10H 20/0364 (2025.01);
Abstract

A display device, a method of manufacturing the same and a tiled display device including the same are provided. The display device includes a first substrate including a first contact hole, a first barrier insulating layer disposed on the first substrate and including a second contact hole overlapping the first contact hole in a thickness direction, a capping layer disposed on the first barrier insulating layer, at least a portion of the capping layer being disposed in the second contact hole and the first contact hole, a pad electrode disposed on the capping layer, a display layer disposed on the pad electrode, and a flexible film disposed under the first substrate and electrically connected to the pad electrode through the first contact hole and the second contact hole.


Find Patent Forward Citations

Loading…