The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Jun. 22, 2022
Applicant:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Inventors:

Chang Yeon Kim, Ansan-si, KR;

Jong Hyeon Chae, Ansan-si, KR;

Chung Hoon Lee, Ansan-si, KR;

Seong Gyu Jang, Ansan-si, KR;

Jong Min Jang, Ansan-si, KR;

Ho Joon Lee, Ansan-si, KR;

Assignee:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/813 (2025.01); H01L 25/04 (2023.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01); H01L 25/075 (2006.01); H10H 20/01 (2025.01); H10H 20/821 (2025.01); H10H 20/825 (2025.01); H10H 20/831 (2025.01); H10H 20/833 (2025.01); H10H 20/84 (2025.01); H10H 20/851 (2025.01); H10H 20/857 (2025.01); H10K 59/32 (2023.01);
U.S. Cl.
CPC ...
H10H 20/813 (2025.01); H01L 25/0756 (2013.01); H10H 20/821 (2025.01); H10H 20/8314 (2025.01); H10H 20/833 (2025.01); H10H 20/84 (2025.01); H10H 20/8514 (2025.01); H10H 20/857 (2025.01); H01L 25/043 (2013.01); H01L 25/0657 (2013.01); H01L 25/074 (2013.01); H01L 25/0753 (2013.01); H10H 20/018 (2025.01); H10H 20/825 (2025.01); H10K 59/32 (2023.02);
Abstract

A light emitting chip including a light emitting structure including first, second, and third light emitting sub-units to emit light of a first color, a second color, and a third color and vertically stacked on each other, and having at least one mesa structure and at least one sidewall having a stepped structure; a plurality of vias electrically connected to the light emitting sub-units, each via has a top surface exposed from the light emitting structure and a bottom surface contacting the light emitting structure, a part of the bottom surfaces of the vias disposed on substantially the same level; and a first passivation layer covering at least a part of the light emitting structure, in which the first passivation layer has a bottom surface exposing the light emitting structure to permit light from the first, second, and third sub-units to be emitted from the light emitting chip.


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