The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Jul. 11, 2022
Applicant:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Inventor:

Chung Hoon Lee, Ansan-si, KR;

Assignee:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H10H 20/01 (2025.01); H01L 25/0756 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/27003 (2013.01); H10H 20/0364 (2025.01);
Abstract

A light emitting display including a circuit board, a plurality of light emitting devices arranged on the circuit board each including a first, LED stack, a second LED stack, and a third LED stack, a bump pad disposed between the circuit board and the light emitting device, the bump pad comprising Au material, and an encapsulating layer comprising an optical interference preventing material and covering the light emitting devices, in which the circuit board includes an interconnection line and a plurality of pads disposed on an upper surface thereof to provide electrical connection, the first, second, and third LED stacks are stacked in a vertical direction, one of the LED stacks configured to emit light having the longest wavelength among the first, second, and third LED stacks is in ohmic contact with the Au material, and the bump pad has an irregular upper surface.


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