The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Feb. 03, 2023
University of Maryland, College Park, College Park, MD (US);
Raphael Kahat Mandel, Washington, DC (US);
Michael M. Ohadi, Clarksville, MD (US);
UNIVERSITY OF MARYLAND, COLLEGE PARK, College Park, MD (US);
Abstract
A manifold-microchannel (MMC) heat sink can comprise a plurality of microchannels and a manifold. The microchannels can be segregated into successive heat transfer stages. The manifold can include at least one connecting channel and at least one vapor permeable membrane portion. Each connecting channel can fluidically couple one of the heat transfer stages to a successive heat transfer stage. Each vapor permeable membrane portion can allow coolant in a vapor phase to pass therethrough while retaining coolant in a liquid phase within the corresponding connecting channel. A vapor quality of the coolant exiting from one of the heat transfer stages into a connecting channel can be greater than a vapor quality of the coolant entering the successive heat transfer stage from the same connecting channel.