The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Apr. 26, 2021
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Hee Jung Lee, Seoul, KR;

Jin Seok Lee, Seoul, KR;

Yong Han Jeon, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/282 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 1/113 (2013.01); H05K 1/0284 (2013.01); H05K 1/0298 (2013.01); H05K 2201/09218 (2013.01); H05K 2203/1377 (2013.01);
Abstract

A circuit board according to an embodiment includes an insulating layer including a first region and a second region; a circuit pattern disposed on an upper surface of the first region and an upper surface of the second region of the insulating layer; and a solder resist including a first portion disposed on the upper surface of the first region of the insulating layer and a second portion disposed the upper surface of the second region; wherein a height of the first portion of the solder resist is smaller than a height of the circuit pattern, wherein a height of the second portion of the solder resist is greater than the height of the circuit pattern, wherein at least one of the first region and the second region is divided into a plurality of partial regions, wherein at least one of the first portion and the second portion of the solder resist has a different height in the plurality of partial regions.


Find Patent Forward Citations

Lee, Hee. (2026). Circuit board (U.S. Patent No. 12550269). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12550269

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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