The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
May. 31, 2023
Applicant:
Innodisk Corporation, New Taipei, TW;
Inventor:
Chih-Chieh Kao, New Taipei, TW;
Assignee:
INNODISK CORPORATION, New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/181 (2026.01); H05K 1/182 (2026.01); H05K 1/189 (2026.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 1/189 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10628 (2013.01);
Abstract
A high capacitance module for electrically connecting to a second circuit board comprises a first circuit board provided with a plurality of metal contacts and at least one capacitor core arranged on the first circuit board. The capacitor cores have connection pins that are electrically connected to the metal contacts through conductive glue. An adhesive layer covers the capacitor cores. The capacitor cores are electrically connected to a memory module arranged on the second circuit board.