The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Nov. 01, 2023
Shinko Electric Industries Co., Ltd., Nagano, JP;
SHINKO ELECTRIC INDUSTRIES, CO., LTD., Nagano, JP;
Abstract
A wiring substrate includes a first wiring layer, an insulation layer covering the first wiring layer, a first through hole extending through the insulation layer and exposing part of the upper surface of the first wiring layer, and a second through hole arranged adjacent to the first through hole. The second through hole extends through the insulation layer in the thickness-wise direction and exposes part of the upper surface of the first wiring layer. A bottom portion of the first through hole is in communication with a bottom portion of the second through hole through a communication hole. A via wiring fills the first through hole, the second through hole, and the communication hole. A second wiring layer is formed integrally with the via wiring on the insulation layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile