The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Mar. 29, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yongsub Jeon, Suwon-si, KR;
Yongjun Shin, Suwon-si, KR;
Kiyoun Jang, Suwon-si, KR;
Chihyun Cho, Suwon-si, KR;
Jaeman Choi, Suwon-si, KR;
Jooyil Pyun, Suwon-si, KR;
Changryong Heo, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
An electronic device according to an embodiment of the disclosure may include a battery. The battery may include: an electrode assembly including a cathode substrate coupled to a cathode tab, an anode substrate coupled to an anode tab, and a separator sheet disposed between the cathode substrate and the anode substrate, and a pouch accommodating the electrode assembly, wherein the pouch includes a bonding portion provided along an edge of the electrode assembly, a first damage detection circuit configured to detect damage to the battery, and a circuit board to which the cathode tab, the anode tab, and the first damage detection circuit are electrically coupled. The battery may include a first portion, a second portion foldable with respect to the first portion, and a folding portion which couples the first portion and the second portion. The first damage detection circuit may extend from a first point of the circuit board to a single point of the second portion by crossing the first portion and the folding portion along an inside of the bonding portion, and extend from the single point of the second portion to a second point of the circuit board by crossing the folding portion and the first portion along the inside of the bonding portion.