The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Jul. 29, 2022
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Cheol Woo Park, Suwon-si, KR;
Jin Hyung Lim, Suwon-si, KR;
Seung Hun Han, Suwon-si, KR;
Ji Hong Jo, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface; a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface; an insulating layer disposed on the first and second connection portions and covering the second surface, and third and fourth band portions; and first and second plating layers respectively disposed on the first and second band portions. The insulating layer includes an oxide containing Ti. The dielectric layer includes one of BaTiO, (BaCa)TiO(0<x<1), Ba(TiCa)O(0<y<1), (BaCa)(TiZr)O(0<x<1, 0<y<1) and Ba(TiZr)O(0<y<1) as a main component.