The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Apr. 01, 2024
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Seung Ho Shin, Suwon-si, KR;

Ji Yeon Kim, Suwon-si, KR;

Si Taek Park, Suwon-si, KR;

Sang Kyu Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/12 (2006.01); H01G 4/30 (2006.01); H01G 4/008 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1227 (2013.01); H01G 4/30 (2013.01); H01G 4/0085 (2013.01);
Abstract

A multilayer electronic component includes a body including a dielectric layer including Ba and Ti and an internal electrode disposed alternately with the dielectric layer; and an external electrode disposed on the body, wherein the dielectric layer further includes Li and F, and wherein a content of Li included in the dielectric layer is 0.02 mole or more and 0.36 mole or less based on 100 moles of Ba included in the dielectric layer.


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Shin, Seung. (2026). Multilayer electronic component (U.S. Patent No. 12548713). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12548713

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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