The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Mar. 03, 2023
Applicant:

Mainstream Engineering Corporation, Rockledge, FL (US);

Inventor:

Benjamin S. Woods, Melbourne, FL (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 13/14 (2006.01); B01J 20/18 (2006.01); B01J 29/00 (2006.01); B01J 35/50 (2024.01); B29C 48/154 (2019.01); B29C 48/155 (2019.01); B29C 70/72 (2006.01); B33Y 10/00 (2015.01); B33Y 70/10 (2020.01); B33Y 80/00 (2015.01); H01B 3/08 (2006.01);
U.S. Cl.
CPC ...
H01B 13/14 (2013.01); B33Y 10/00 (2014.12); B33Y 70/10 (2020.01); B33Y 80/00 (2014.12); H01B 3/08 (2013.01); B01J 20/18 (2013.01); B01J 29/00 (2013.01); B01J 35/50 (2024.01); B01J 2220/40 (2013.01); B01J 2229/00 (2013.01); B29C 48/154 (2019.02); B29C 48/155 (2019.02); B29C 70/72 (2013.01);
Abstract

A structure fabricated of a zeolite-based paste with an intra-layer continuous wire embedded is disclosed. Vitally, the continuous wire is extended past the bounds of the structure's walls, creating bare wire leads that allow for connection to a power source for electrification. The structure is made of multiple layers stacked together, typically in an additive manufacturing (3D printing) process. Within this structure, at least one layer has an embedded wire running through at least some portion of it, and is equipped with two bare wire leads protruding from the structure. This wire is designed to act as a heating element for uniform Joule heating of the zeolite structure for reduced power consumption and temperature ramp-up time during a desorption process, as well as reduced system footprint and enhanced mechanical properties. The frequency of wire embedment (a wire embedded in every nlayer), the percentage of the embedded layer that contains the wire, and the wire gauge and material/composition can be modified for the desired application.


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