The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Jun. 01, 2021
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Hirotsugu Kishimoto, Gyeonggi-do, KR;

Dasom Gu, Asan-si, KR;

Yongchan Jeon, Cheonan-si, KR;

Hyun-Been Hwang, Suwon-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/046 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); B32B 37/06 (2006.01); B32B 37/12 (2006.01); G06F 3/044 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
G06F 3/046 (2013.01); B32B 7/12 (2013.01); B32B 15/04 (2013.01); B32B 15/18 (2013.01); B32B 37/06 (2013.01); B32B 37/12 (2013.01); G06F 3/0443 (2019.05); B32B 2038/0076 (2013.01); B32B 2255/26 (2013.01); B32B 2264/105 (2013.01); B32B 2305/72 (2013.01); B32B 2307/208 (2013.01); B32B 2307/4026 (2013.01); B32B 2307/51 (2013.01); B32B 2307/558 (2013.01); B32B 2310/08 (2013.01); B32B 2457/208 (2013.01); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04107 (2013.01);
Abstract

An electronic apparatus includes a window, a display panel disposed below the window, and a digitizer disposed below the display panel. The digitizer includes a base layer having a first surface and a second surface opposing the first surface, a first sensing coil disposed on the first surface of the base layer, a second sensing coil disposed on the second surface of the base layer, a first adhesive layer disposed on the first sensing coil, and a second adhesive layer disposed on the second sensing coil. The first adhesive layer and the second adhesive layer are multi-curing adhesive layers.


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