The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Apr. 18, 2024
Applicant:

Seoul Semiconductor Co., Ltd., Ansan-si, KR;

Inventor:

Chung Hoon Lee, Ansan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 13/00 (2006.01); F21V 3/12 (2018.01); F21V 7/04 (2006.01); F21V 7/24 (2018.01); F21V 8/00 (2006.01); F21V 9/30 (2018.01); F21V 13/08 (2006.01); G02F 1/13357 (2006.01); H01L 25/075 (2006.01); H10H 20/851 (2025.01); H10H 20/856 (2025.01); F21Y 105/16 (2016.01); F21Y 115/10 (2016.01); G02F 1/1335 (2006.01); H10H 20/812 (2025.01); H10H 20/815 (2025.01); H10H 20/816 (2025.01); H10H 20/825 (2025.01); H10H 20/833 (2025.01); H10H 20/841 (2025.01);
U.S. Cl.
CPC ...
F21V 13/08 (2013.01); F21V 3/12 (2018.02); F21V 7/04 (2013.01); F21V 7/24 (2018.02); F21V 9/30 (2018.02); G02B 6/0055 (2013.01); G02B 6/0073 (2013.01); G02F 1/133603 (2013.01); G02F 1/133605 (2013.01); G02F 1/133606 (2013.01); H01L 25/0753 (2013.01); H10H 20/8514 (2025.01); H10H 20/856 (2025.01); F21Y 2105/16 (2016.08); F21Y 2115/10 (2016.08); G02F 1/133614 (2021.01); H10H 20/812 (2025.01); H10H 20/815 (2025.01); H10H 20/816 (2025.01); H10H 20/825 (2025.01); H10H 20/833 (2025.01); H10H 20/841 (2025.01); H10H 20/8512 (2025.01);
Abstract

The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.


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