The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Apr. 10, 2024
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Adam O. Moughton, Minneapolis, MN (US);

Michael J. Maher, St. Paul, MN (US);

Andrew Satrijo, St. Paul, MN (US);

Jonathan E. Janoski, Woodbury, MN (US);

Aaron T. Hedegaard, Woodbury, MN (US);

Kathleen S. Shafer, Woodbury, MN (US);

Kelly A. Volp, Minneapolis, MN (US);

Michael K. Kennedy, Savage, MN (US);

Ramesh C. Lhila, Woodbury, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/30 (2018.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 15/082 (2006.01); C08K 5/19 (2006.01); C08K 5/3415 (2006.01); C08K 5/3432 (2006.01); C08K 5/3445 (2006.01); C08K 5/36 (2006.01); C08L 51/00 (2006.01);
U.S. Cl.
CPC ...
C09J 7/30 (2018.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 15/082 (2013.01); C08K 5/19 (2013.01); C08K 5/3415 (2013.01); C08K 5/3432 (2013.01); C08K 5/3445 (2013.01); C08K 5/36 (2013.01); C08L 51/006 (2013.01); C08K 2201/001 (2013.01); C08L 2203/20 (2013.01); C09J 2301/408 (2020.08); C09J 2301/502 (2020.08); C09J 2400/163 (2013.01); C09J 2453/00 (2013.01);
Abstract

Curable and cured compositions as well as articles containing the curable or cured compositions are provided. The cured compositions are typically a semi-structural or structural adhesive. Advantageously, the cured compositions can be removed (e.g., de-bonded) from the various surfaces of the articles after the useful lifetime of the articles, to correct misplacement of a part during manufacturing, or to repair the electronic device. The separation step occurs using a direct current electric potential across the cured composition.


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