The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Jul. 11, 2024
Applicant:

Korea Electrotechnology Research Institute, Changwon, KR;

Inventors:

Seung Kwon Seol, Namyangju, KR;

Sang Hyeon Lee, Gangneung, KR;

Won Suk Chang, Seoul, KR;

Jae Yeon Pyo, Changwon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); C09D 11/033 (2014.01); C09D 11/037 (2014.01); C09D 11/14 (2006.01); C09D 11/322 (2014.01); C09D 11/38 (2014.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); C09D 11/033 (2013.01); C09D 11/037 (2013.01); C09D 11/14 (2013.01); C09D 11/322 (2013.01); C09D 11/38 (2013.01); C23C 18/1608 (2013.01); C23C 18/161 (2013.01); C23C 18/2066 (2013.01); H05K 3/182 (2013.01);
Abstract

A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30° C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.


Find Patent Forward Citations

Seol, Seung. (2026). Catalyst ink for plating and electroless plating method using same (U.S. Patent No. 12545799). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12545799

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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