The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Sep. 18, 2023
Applicant:

Notark Corporation, Houston, TX (US);

Inventors:

Jason Tian, Houston, TX (US);

Ruidong Ding, Houston, TX (US);

Vijay Mhetar, Houston, TX (US);

Assignee:

Notark Corporation, The Woodlands, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 25/16 (2006.01); C08J 5/18 (2006.01); C08K 9/06 (2006.01);
U.S. Cl.
CPC ...
C08L 25/16 (2013.01); C08J 5/18 (2013.01); C08J 2325/18 (2013.01); C08J 2353/02 (2013.01); C08K 9/06 (2013.01); C08K 2201/005 (2013.01); C08K 2201/011 (2013.01); C08L 2203/16 (2013.01);
Abstract

This disclosure relates to a film layer for use in flexible metal clad laminates. The film layer comprises a thermosetting composition comprising: a copolymer of (a) a diisoalkenylarene (DIAEA) and (b) a divinylarene (DVA) containing a mixture of m-divinylarene and p-divinylarene, in a mole ratio of (a) to (b) of 15:1 to 1:15; a second polymer; a filler and optional additives. Flexible metal clad laminates made with the film further comprises a metal foil bonded to the surface of the film. The thermosetting composition containing the DIAEA-DVA copolymer provides improved thermal stability at high temperature, excellent processability, and electrical properties, e.g., Dk and Df.


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