The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Oct. 13, 2020
Ineos Styrolution Group Gmbh, Frankfurt am Main, DE;
Christian Ruthard, Mainz, DE;
INEOS STYROLUTION GROUP GMBH, Frankfurt, DE;
Abstract
The invention relates to a thermoplastic molding composition (P) comprising: (A) thermoplastic polymer composition (A) comprising: (A-1) 10 to 50 wt.-% of graft copolymer (A-1), (A-2) 1 to 50 wt.-%, of thermoplastic polymer matrix (A-2) based on one or more vinylaromatic copolymers, (A-3) 20 to 50 wt.-%, of polymerized alkyl methacrylate component (A-3), and (A-4) 0 to 45 wt.-% of comonomer which is copolymerized with the at least one polymerized alkyl methacrylate component (A-3), where the sum of (A-1), (A-2), (A-3) and optional comonomers (A-4) is 83.2 to 99.8 wt.-%; (B) a hindered amine light stabilizer composition (B), comprising at least two of substances (B-1) to (B-3): (B-1) 0 to 0.9 wt.-%, of at least one hindered amine light stabilizer having a dipiperidine structure with at least one alkyl group at each of the 2 and 6 positions of the dipiperidine structure (B-2) 0 to 0.9 wt.-%, of a hindered amine light stabilizer mixture having a monopiperidine structure with at least one alkyl group at each of the 2 and 6 positions of the monopiperidine structure, and (B-3) 0 to 2 wt.-%, of at least one hindered amine light stabilizer having a polymeric structure comprising piperidine groups with at least one alkyl group at each of the 2 and 6 positions of the piperidine groups (C) 0 to 5 wt.-%, of one or more further additives (C), different from (B); and (D) 0 to 10 wt.-%, of colorants, dyes and/or pigments (D), different from (C); wherein the constituents (A) to (D) sum up to 100 wt.-% of the molding composition (P).