The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Feb. 17, 2021
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Hiroyoshi Kawasaki, Tokyo, JP;
Masato Shiratori, Tokyo, JP;
Kazuhiro Minegishi, Tokyo, JP;
Yuji Kawamata, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/36 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/362 (2006.01); C22C 13/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3613 (2013.01); B23K 35/025 (2013.01); B23K 35/262 (2013.01); B23K 35/264 (2013.01); B23K 35/3618 (2013.01); B23K 35/362 (2013.01); B23K 35/3601 (2013.01); C22C 13/02 (2013.01);
Abstract
A flux containing an organic acid, an acrylic resin, a rosin, a thixotropic agent, and a solvent, but not containing water is adopted. In this flux, the organic acid includes 1,2,3-propanetricarboxylic acid, and the content of the 1,2,3-propanetricarboxylic acid is 0.1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux. According to this flux, the wettability of solder can be enhanced, temperature cycle reliability is excellent, and scattering due to heating during reflow can be suppressed.