The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Jan. 04, 2021
Applicant:

Schott Ag, Mainz, DE;

Inventors:

Bernhard Hunzinger, Wackenheim, DE;

Ali Al-Zuhairi, Rüsselsheim, DE;

Andreas Ortner, Gau-Algesheim, DE;

Andreas Koglbauer, Trebur, DE;

Imke Adrian, Rüsselsheim, DE;

Assignee:

SCHOTT AG, Mainz, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/53 (2014.01); B23K 26/40 (2014.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/40 (2013.01); B23K 26/53 (2015.10); B23K 2103/54 (2018.08);
Abstract

A method for the separative processing of brittle-hard materials is provided. The method includes irradiating a surface of a workpiece made of brittle-hard material with a laser beam having a wavelength sufficient so that light of the laser beam is absorbed at the surface and so that the workpiece is heated to create a first temperature gradient in a direction from the surface to an interior of the workpiece; guiding the laser beam over the surface along an irradiated region; forming a second temperature gradient along the surface between the irradiated region and a non-irradiated region adjacent the irradiated region, the first and second temperature gradients interacting in such a way that, on account of thermomechanical stresses, the workpiece is separated below the surface with a portion of the workpiece being severed in the form of a chip.


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