The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Apr. 10, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Keumhee MA, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a first semiconductor chip including a first semiconductor substrate, and a first upper pad arranged on an upper surface of the first semiconductor substrate, a first polymer layer arranged on the upper surface of the first semiconductor substrate, a second semiconductor chip mounted on the first semiconductor chip, the second semiconductor chip including a second semiconductor substrate and a second lower pad arranged under a lower surface of the second semiconductor substrate, wherein the first polymer layer has a horizontal width in a direction crossing the first polymer layer in a center region of the second semiconductor chip, as a first length, and has a horizontal width in a direction crossing two corner regions of the first polymer layer in corner regions of the second semiconductor chip, as a second length, wherein the second length is greater than the first length.