The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Jul. 25, 2022
Applicant:
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Inventor:
Thomas Dungan, Fort Collins, CO (US);
Assignee:
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/49816 (2013.01); H01L 23/5385 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/08225 (2013.01);
Abstract
An interposer, and integrated circuit including an interposer, has a lower surface adapted for bump mounting and an upper surface adapted for copper bonding. An interposer layer includes active interposers and passive interposers. Bridges connect interposers in the interposer layer to produce a functionally large interposer from smaller interposer dies. A core may overlap more than one interposer in the interposer layer. Active interposers are disposed around the edge of the core with passive interposers beneath the core to facilitate heat dissipation.