The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Jan. 22, 2024
Shinko Electric Industries Co., Ltd., Nagano, JP;
Masaya Takizawa, Nagano, JP;
Yuki Kobayashi, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A wiring board includes an insulating layer covering upper and side surfaces of a first interconnect layer, a via hole penetrating the insulating layer and reaching the first interconnect layer, a second interconnect layer filling the via hole and extending on the insulating layer, and a cavity provided in the first interconnect layer, communicating with the via hole and extending outside than a lower end of an inner side surface of the via hole in a plan view. The second interconnect layer includes a first seed layer provided on the insulating layer, a second seed layer continuously covering upper and inner side surfaces of the first seed layer, the inner side surface of the via hole, and surfaces of the insulating layer and the first interconnect layer exposed inside the cavity, and an electrolytic plating layer provided on the second seed layer thicker than the first seed layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile