The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

Apr. 14, 2023
Applicant:

Allegro Microsystems, Llc, Manchester, NH (US);

Inventors:

Vijay Mangtani, Nashua, NH (US);

William P. Taylor, Amherst, NH (US);

Paul A. David, Bow, NH (US);

Assignee:

Allegro MicroSystems, LLC, Manchester, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01F 27/28 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01F 27/2804 (2013.01); H01L 23/3107 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 2224/48245 (2013.01);
Abstract

Aspects of the present disclosure include systems, structures, circuits, and methods providing voltage-isolated integrated circuit (IC) packages or modules having a transformer integrated with or implemented on a lead frame. A portion of transformer windings may include a conductive portion of a lead frame. Conductive structure, such as wire bonds, may be used for other portions of transformer windings. In some examples, an insulating coating may be placed on the package to increase the isolation capability of the final package. The IC packages and modules may include various types of circuits; in some examples, IC packages or modules may include a galvanically isolated gate driver or other high voltage circuit.


Find Patent Forward Citations

Mangtani, Vijay. (2026). Voltage-isolated integrated circuit packages (U.S. Patent No. 12543574). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12543574

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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