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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12543538 B1

PDFFull Text
Date of Patent:
Feb. 03, 2026

Filed:

May. 21, 2021

Temporary fixation layered film and production method therefor, temporary fixation layered body, and semiconductor device production method

Applicant:

Resonac Corporation, Tokyo, JP;

Inventors:

Yuta Akasu, Tokyo, JP;

Emi Miyazawa, Tokyo, JP;

Takashi Kawamori, Tokyo, JP;

Yasuyuki Oyama, Tokyo, JP;

Tetsuya Enomoto, Tokyo, JP;

Assignee:
Attorney:

SHIPWAY IP

Primary Examiner:

Christine S Kim

Assistant Examiner:

Cole Leon Lindsey

Int. Cl.
CPC ...
H01L 21/683 (2006.01); B32B 15/085 (2006.01); B32B 15/092 (2006.01); B32B 38/00 (2006.01); C09J 7/28 (2018.01); C09J 125/08 (2006.01); C09J 163/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 15/085 (2013.01); B32B 15/092 (2013.01); C09J 7/28 (2018.01); C09J 125/08 (2013.01); C09J 163/00 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); B32B 2038/0076 (2013.01); B32B 2250/03 (2013.01); B32B 2310/0825 (2013.01); B32B 2405/00 (2013.01); B32B 2457/14 (2013.01); C09J 2203/326 (2013.01); C09J 2301/124 (2020.08); C09J 2301/414 (2020.08); C09J 2301/416 (2020.08); C09J 2301/502 (2020.08); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01);
Abstract

A method for producing a laminated film for temporary fixation of a semiconductor member to a support member includes providing a first curable resin layer on one surface of a metal foil and providing a second curable resin layer on the other surface of the metal foil to obtain the laminated film. A laminated film used for temporarily fixing a semiconductor member to a support member includes a first curable resin layer, a metal foil, and a second curable resin layer laminated in sequence.

Find Patent Forward Citations

Akasu, Yuta. (2026). Temporary fixation layered film and production method therefor, temporary fixation layered body, and semiconductor device production method (U.S. Patent No. 12543538). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12543538

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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