The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

Nov. 24, 2020
Applicant:

Jusung Engineering Co., Ltd., Gwangju-Si, KR;

Inventors:

Won Tae Cho, Gwangju-Si, KR;

Chul Joo Hwang, Gwangju-Si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/285 (2006.01); C23C 16/04 (2006.01); C23C 16/18 (2006.01); C23C 16/455 (2006.01); C23C 28/02 (2006.01); C25D 3/38 (2006.01); C25D 5/02 (2006.01); C25D 7/12 (2006.01); H01L 21/027 (2006.01); H10D 30/67 (2025.01); H10D 99/00 (2025.01);
U.S. Cl.
CPC ...
H01L 21/28562 (2013.01); C23C 16/042 (2013.01); C23C 16/18 (2013.01); C23C 16/45553 (2013.01); C23C 28/023 (2013.01); C25D 3/38 (2013.01); C25D 5/022 (2013.01); C25D 7/123 (2013.01); H01L 21/0272 (2013.01); H10D 30/6755 (2025.01); H10D 99/00 (2025.01);
Abstract

A method of forming an electrode in accordance with an exemplary embodiment includes a process of forming a mask pattern on one surface of a base to expose a partial area of the one surface of the base by using a mask material that is polymer including an end tail having at least one bonding structure of covalent bond and double bond, a process of loading the base on which the mask pattern is formed into a chamber, and a process of forming a conductive layer containing copper on the exposed one surface of the base by using an atomic layer deposition method that alternately injects a source material containing copper and a reactive material that reacts with the source material into the chamber. Thus, according to the method of forming an electrode in accordance with an exemplary embodiment, a thin-film caused by a material for forming an electrode is not formed on a surface of the mask pattern. Therefore, a residue is not remained when the mask pattern is removed to prevent a defect caused by the residue from being generated.


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