The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

May. 31, 2022
Applicants:

Mianyang Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Yongkai Wu, Beijing, CN;

Zhengping Xiong, Beijing, CN;

Yunzhi Wang, Beijing, CN;

Haoyuan Fan, Beijing, CN;

Bo Zhang, Beijing, CN;

Jinyu Chao, Beijing, CN;

Shuaimin Jian, Beijing, CN;

Yixiang Yang, Beijing, CN;

Gaoyun Wang, Beijing, CN;

Chao Liu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 50/84 (2023.01); H10K 50/842 (2023.01); H10K 59/40 (2023.01); H10K 59/80 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 50/8423 (2023.02); H10K 59/40 (2023.02); H10K 59/873 (2023.02); H10K 2102/311 (2023.02);
Abstract

The display panel includes an opening region, a barrier region surrounding the opening region, a display region surrounding the barrier region, a base substrate, a crack blocking structure surrounding the opening region; a barrier wall surrounding the crack blocking structure. The barrier wall and the crack blocking structure include a first metal layer and a first organic layer, an edge of side of the first metal layer away from the base substrate is indented relative to an edge of side of the first organic layer proximal to the base substrate. The barrier wall and the crack blocking structure includes a deep groove penetrating through a film layer between the first organic layer and the base substrate, the deep groove surrounds the opening region. The first organic layer fills the deep groove and is connected to the base substrate.


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