The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

Oct. 30, 2022
Applicant:

Innolux Corporation, Miaoli County, TW;

Inventors:

Pei-Chi Chen, Miaoli County, TW;

Wen-Chi Fang, Miaoli County, TW;

Jen-Hai Chi, Miaoli County, TW;

Zhi-Fu Huang, Miaoli County, TW;

Jia-Sin Lin, Miaoli County, TW;

Wan-Chun Tsai, Miaoli County, TW;

Assignee:

Innolux Corporation, Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0044 (2013.01); H05K 3/30 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10174 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/025 (2013.01); H05K 2203/0264 (2013.01);
Abstract

A manufacturing method of an electronic device including following steps is provided. A first substrate is provided. A thermal release adhesive layer is provided on the first substrate. A thinning process is performed on the first substrate to form a first thinned substrate. A cutting process is performed on the first thinned substrate to form a first sub-substrate. The thermal release adhesive layer is separated from the first thinned substrate or the first sub-substrate. In the manufacturing method of the electronic device provided in one or more embodiments of the disclosure, the manufacturing process of the electronic device may be simplified, and/or defects of the resultant electronic device may be reduced.


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