The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

May. 09, 2022
Applicant:

Linxens Holding, Mantes la Jolie, FR;

Inventors:

Khiengkrai Khusuwan, Bang pa-in, TH;

Anupont Phakping, Bang pa-in, TH;

Assignee:

LINXENS HOLDING, Mantes-la-Jolie, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 7/10 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0277 (2013.01); G06K 7/10366 (2013.01);
Abstract

The present invention refers to a pre-package for a flexible printed circuit board for a smartcard. The pre-package comprises a flexible printed circuit board including one or more non-planar circuit portions; a first layer of a first material at least partially covering a first side of the flexible printed circuit board so as to form a planar layer; a second layer of a second material covering a second side of the flexible printed circuit board; and a third layer comprising a hardening material at least partially covering the first side so as to form a planar layer. The third layer has a third hardness value which is higher than the first hardness value and/or than the second hardness value of the first and second dielectric materials, respectively. The pre-package may be advantageously inserted into a smartcard having a suitable window for accommodating the pre-package comprising the electronic components. The present invention also refers to the methods for forming the pre-package and the smartcard comprising it.


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