The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Mar. 06, 2023
Shenzhen Microbt Electronics Technology Co., Ltd., Guangdong, CN;
Yuefeng Wu, Guangdong, CN;
Haifeng Guo, Guangdong, CN;
Shilei Yuan, Guangdong, CN;
Fangyu Liu, Guangdong, CN;
SHENZHEN MICROBT ELECTRONICS TECHNOLOGY CO., LTD., Guangdong, CN;
Abstract
Embodiments of this application disclose a heat sink, a heat dissipation unit, and a server. A first surface of the heat sink is provided with a heat dissipation fin, and a second surface of the heat sink is configured to dock with a circuit board. A heating element, such as a chip, is arranged on the circuit board. A die of the chip is located on a surface of the chip away from the circuit board, that is, the chip is packaged into a flipchip or packaged into a flipchip with an exposed die. At a position corresponding to the die, the second surface of the heat sink is provided with a protection groove, with a cross-sectional area of the protection groove being at least greater than an area of the die.