The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Mar. 30, 2022
Applicant:
Ngk Insulators, Ltd., Nagoya, JP;
Inventors:
Seiya Inoue, Handa, JP;
Tatsuya Kuno, Nagoya, JP;
Assignee:
NGK INSULATORS, LTD., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/28 (2006.01); H01L 21/683 (2006.01); H05B 3/06 (2006.01); H05B 3/26 (2006.01);
U.S. Cl.
CPC ...
H05B 3/283 (2013.01); H01L 21/6833 (2013.01); H05B 3/06 (2013.01); H05B 3/262 (2013.01); H05B 2203/01 (2013.01); H05B 2203/017 (2013.01);
Abstract
A member for a semiconductor manufacturing apparatus includes a disk-shaped or annular ceramic heater, a metal base, an adhesive element bonding the metal base and the ceramic heater, an adhesive protective element disposed between the ceramic heater and the metal base to extend along a periphery of the adhesive element, and an anti-adhesion layer disposed between the adhesive element and the protective element, the anti-adhesion layer preventing adhesion between the adhesive element and the protective element.