The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

Aug. 02, 2022
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Hironori Fukuhara, Ibaraki, JP;

Rei Goto, Osaka, JP;

Keiichi Maki, Suita, JP;

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/25 (2006.01); H03H 3/08 (2006.01); H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/145 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 9/25 (2013.01); H03H 3/08 (2013.01); H03H 9/02574 (2013.01); H03H 9/1071 (2013.01); H03H 9/1092 (2013.01); H03H 9/145 (2013.01); H03H 9/64 (2013.01);
Abstract

A packaged surface acoustic wave device is disclosed. The packaged surface acoustic wave device can include a support substrate that has a first side and a second side opposite the first side. The support substrate including a conductive via extending vertically between the first side to the second side. The packaged surface acoustic wave device can include a piezoelectric layer over the first side of the support substrate, an interdigital transducer electrode over the piezoelectric layer, a roof structure over the interdigital transducer electrode, and a conductive pillar between the first side of the support substrate and the roof structure. The conductive pillar supports the roof structure and defines at least a portion of an electrical pathway between the interdigital transducer electrode and the conductive via. A maximum horizontal dimension of the conductive pillar is greater than a maximum horizontal dimension of the conductive via.


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